10th IEEE International RF and Microwave Conference (RFM 2025)

Bridging the Gap: EDA & Multiphysics Simulation for High-Speed Electronics

Modern electronic systems are becoming increasingly complex, creating significant challenges for engineers, as they are responsible for ensuring reliable high-speed data transmission, suppressing electromagnetic interference (EMI) and managing power delivery and thermal effects within highly integrated devices. In order to address these challenges, engineers rely on advanced methods for design, validation and optimization including electronic design automation (EDA) and multiphysics simulation tools, such as CST Studio Suite. These tools have become undeniably critical in both academia and industry.

This topic will discuss how simulation workflows can be applied to practical design problems, including schematic verification, signal and power integrity assessment, parasitic extraction and both package- and PCB-level analysis. By predicting performance prior to fabrication, engineers can evaluate eye diagrams, impedance matching, IR drop and crosstalk, enabling earlier detection of design flaws and reducing costly prototyping. A multiphysics approach further captures interactions between electrical, electromagnetic and thermal domains, enhancing system-level reliability.

Through these methods, engineers can anticipate design challenges, meet industry standards and accelerate innovation across consumer electronics, automotive, aerospace and communication technologies.